| Rear module: |
RM60 |
| General use: |
3Gb/s audio embedder/de-embedder |
| Used with: |
TANDEM 310 and TANDEM 3G |
| Connectors: |
2 BNCs, 26-way high density D-Type and 1 optical input/output connector |
| Frame slots used: |
1 |
| Boards in 4U: |
24 |
| Boards in 2U: |
12 |
| Boards in 1U: |
6 |
| Boards in DTB: |
2 |
| Notes: |
Allows maximum number of boards in frame. Designed for integrated fibre applications - choose between fibre in or fibre out by selecting FIP input or FOP output option. D-Type is suitable for 110 ohm AES audio |
| Alternatives: |
RM47 (for non-fibre 110 ohm AES), RM49 (for non-fibre 75 ohm AES) and RM61 (for fibre 75 ohm AES) |
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